Jamshid Sorooshian: Principles of Dielectric Chemical Mechanical Planarization : TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Taschenbuch
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) processes in semiconduc… Mehr…
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore s Law, material characterization and process impacts are critical in providing manufacturer s with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process. 372 pp. Englisch, Books<
Jamshid Sorooshian: Principles of Dielectric Chemical Mechanical Planarization : TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Taschenbuch
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware -Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are deve… Mehr…
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware -Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore s Law, material characterization and process impacts are critical in providing manufacturer s with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process. 372 pp. Englisch, Books<
[ED: Softcover], [PU: VDM Verlag Dr. Müller], Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of t… Mehr…
[ED: Softcover], [PU: VDM Verlag Dr. Müller], Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore s Law, material characterization and process impacts are critical in providing manufacturer s with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process.
2009. 372 S. 220 mm
Versandfertig in 6-10 Tagen, DE, [SC: 0.00], Neuware, gewerbliches Angebot, Offene Rechnung (Vorkasse vorbehalten)<
booklooker.de
buecher.de GmbH & Co. KG Versandkosten:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
*Principles of Dielectric Chemical Mechanical Planarization* - TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES / T… Mehr…
*Principles of Dielectric Chemical Mechanical Planarization* - TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES / Taschenbuch für 78.99 € / Aus dem Bereich: Bücher, Wissenschaft, Technik Medien > Bücher nein Buch (kartoniert) Hardcover;Naturwissenschaften, Medizin, Informatik, Technik;Elektronik, Elektrotechnik, Nachrichtentechnik, VDM Verlag Dr. Müller<
Hugendubel.de
Versandkosten:Shipping in 1-2 weeks, , Versandkostenfrei nach Hause oder Express-Lieferung in Ihre Buchhandlung., DE. (EUR 0.00) Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
Principles of Dielectric Chemical Mechanical Planarization ab 78.99 € als Taschenbuch: TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLA… Mehr…
Principles of Dielectric Chemical Mechanical Planarization ab 78.99 € als Taschenbuch: TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > Bücher, VDM Verlag Dr. Müller<
Hugendubel.de
Nr. 8944037. Versandkosten:, , DE. (EUR 0.00) Details...
(*) Derzeit vergriffen bedeutet, dass dieser Titel momentan auf keiner der angeschlossenen Plattform verfügbar ist.
Principles of Dielectric Chemical Mechanical Planarization : TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Taschenbuch
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) processes in semiconduc… Mehr…
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware - Printed after ordering - Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore s Law, material characterization and process impacts are critical in providing manufacturer s with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process. 372 pp. Englisch, Books<
Principles of Dielectric Chemical Mechanical Planarization : TRIBOLOGICAL, THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES - Taschenbuch
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware -Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are deve… Mehr…
[EAN: 9783639176810], Neubuch, [PU: VDM Verlag Dr. Müller], nach der Bestellung gedruckt Neuware -Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore s Law, material characterization and process impacts are critical in providing manufacturer s with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process. 372 pp. Englisch, Books<
[ED: Softcover], [PU: VDM Verlag Dr. Müller], Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of t… Mehr…
[ED: Softcover], [PU: VDM Verlag Dr. Müller], Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore s Law, material characterization and process impacts are critical in providing manufacturer s with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process.
2009. 372 S. 220 mm
Versandfertig in 6-10 Tagen, DE, [SC: 0.00], Neuware, gewerbliches Angebot, Offene Rechnung (Vorkasse vorbehalten)<
Versandkosten:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) buecher.de GmbH & Co. KG
*Principles of Dielectric Chemical Mechanical Planarization* - TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES / T… Mehr…
*Principles of Dielectric Chemical Mechanical Planarization* - TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES / Taschenbuch für 78.99 € / Aus dem Bereich: Bücher, Wissenschaft, Technik Medien > Bücher nein Buch (kartoniert) Hardcover;Naturwissenschaften, Medizin, Informatik, Technik;Elektronik, Elektrotechnik, Nachrichtentechnik, VDM Verlag Dr. Müller<
Versandkosten:Shipping in 1-2 weeks, , Versandkostenfrei nach Hause oder Express-Lieferung in Ihre Buchhandlung., DE. (EUR 0.00)
Principles of Dielectric Chemical Mechanical Planarization ab 78.99 € als Taschenbuch: TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLA… Mehr…
Principles of Dielectric Chemical Mechanical Planarization ab 78.99 € als Taschenbuch: TRIBOLOGICAL THERMAL AND KINETIC CHARACTERIZATION OF DIELECTRIC AND Tungsten CHEMICAL MECHANICAL PLANARIZATION PROCESSES. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > Bücher, VDM Verlag Dr. Müller<
1Da einige Plattformen keine Versandkonditionen übermitteln und diese vom Lieferland, dem Einkaufspreis, dem Gewicht und der Größe des Artikels, einer möglichen Mitgliedschaft der Plattform, einer direkten Lieferung durch die Plattform oder über einen Drittanbieter (Marketplace), etc. abhängig sein können, ist es möglich, dass die von eurobuch angegebenen Versandkosten nicht mit denen der anbietenden Plattform übereinstimmen.
Chemical Mechanical Planarization (CMP) processes in semiconductor manufacturing are developed based on the quality, efficiency and cost of the proposed process. CMP applications in semiconductor manufacturing are highly dependent on consumables (i.e., polishing slurries, pads and diamond discs) quality. Coupling this with the pace of technology turn over as defined by Moore's Law, material characterization and process impacts are critical in providing manufacturer's with the greatest level of studied and known effects to an existing process in order to improve the efficiency of the path finding and development stages of process creation. This thesis presents a series of studies based on oxide and tungsten planarization processes geared towards achieving the aforementioned goals. The capstone of this work is a novel and most accurate model of material removal rate based on a kinetic Langmuir-Hinshelwood removal rate model. The series of studies shown in this work also focus on the parametric characterization of variations to the CMP process as would be seen from a thermal, kinetic and tribological aspects of the process.
Detailangaben zum Buch - Principles of Dielectric Chemical Mechanical Planarization
EAN (ISBN-13): 9783639176810 ISBN (ISBN-10): 3639176812 Gebundene Ausgabe Taschenbuch Erscheinungsjahr: 2009 Herausgeber: VDM Verlag Dr. Müller
Buch in der Datenbank seit 2009-12-19T15:15:36+01:00 (Berlin) Detailseite zuletzt geändert am 2024-01-23T04:12:15+01:00 (Berlin) ISBN/EAN: 3639176812
ISBN - alternative Schreibweisen: 3-639-17681-2, 978-3-639-17681-0 Alternative Schreibweisen und verwandte Suchbegriffe: Titel des Buches: chemical process principles, kinetic