2022, ISBN: 9783030934415
Springer, Kindle Ausgabe, 551 Seiten, Publiziert: 2022-03-01T00:00:00.000Z, Produktgruppe: Digital Ebook Purchas, Maschinenbau, Ingenieurwissenschaften, Fachbücher, Kategorien, Bücher, Ma… Mehr…
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2022, ISBN: 9783030934415
Editor: Salleh, Mohd Arif Anuar Mohd, Editor: Abdul Aziz, Mohd Sharizal, Editor: Jalar, Azman, Editor: Izwan Ramli, Mohd Izrul, Springer, Kindle Edition, 551 Seiten, Publiziert: 2022-03-0… Mehr…
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2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), 1st ed. 2022, [PU: Springer International Publishing], Seiten: 328, Springer International Publishing, 2022
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ISBN: 9783030934415
Recent Progress in Lead-Free Solder Technology - Materials Development Processing and Performances: ab 149.99 € eBooks > Sachthemen & Ratgeber > Technik Springer International Publishing,… Mehr…
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2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), Auflage, [PU: Springer-Verlag], [ED: 1], Springer-Verlag, 2022
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Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances (Topics in Mining, Metallurgy and Materials Engineering) (English Edition) - neues Buch
2022, ISBN: 9783030934415
Springer, Kindle Ausgabe, 551 Seiten, Publiziert: 2022-03-01T00:00:00.000Z, Produktgruppe: Digital Ebook Purchas, Maschinenbau, Ingenieurwissenschaften, Fachbücher, Kategorien, Bücher, Ma… Mehr…
2022, ISBN: 9783030934415
Editor: Salleh, Mohd Arif Anuar Mohd, Editor: Abdul Aziz, Mohd Sharizal, Editor: Jalar, Azman, Editor: Izwan Ramli, Mohd Izrul, Springer, Kindle Edition, 551 Seiten, Publiziert: 2022-03-0… Mehr…
2022
ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), 1st ed. 2022, [PU: Springer International Publishing], Seiten: 328, Springer International Publishing, 2022
ISBN: 9783030934415
Recent Progress in Lead-Free Solder Technology - Materials Development Processing and Performances: ab 149.99 € eBooks > Sachthemen & Ratgeber > Technik Springer International Publishing,… Mehr…
2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), Auflage, [PU: Springer-Verlag], [ED: 1], Springer-Verlag, 2022
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Detailangaben zum Buch - Recent Progress in Lead-Free Solder Technology
EAN (ISBN-13): 9783030934415
Erscheinungsjahr: 2022
Herausgeber: Springer-Verlag
Buch in der Datenbank seit 2022-05-09T17:16:43+02:00 (Berlin)
Detailseite zuletzt geändert am 2023-01-04T20:57:06+01:00 (Berlin)
ISBN/EAN: 9783030934415
ISBN - alternative Schreibweisen:
978-3-030-93441-5
Daten vom Verlag:
Autor/in: Mohd Arif Anuar Mohd Salleh; Mohd Sharizal Abdul Aziz; Azman Jalar; Mohd Izrul Izwan Ramli
Titel: Topics in Mining, Metallurgy and Materials Engineering; Recent Progress in Lead-Free Solder Technology - Materials Development, Processing and Performances
Verlag: Springer; Springer International Publishing
328 Seiten
Erscheinungsjahr: 2022-03-01
Cham; CH
Sprache: Englisch
149,79 € (DE)
154,00 € (AT)
177,00 CHF (CH)
Available
XII, 328 p. 180 illus., 143 illus. in color.
EA; E107; eBook; Nonbooks, PBS / Technik/Maschinenbau, Fertigungstechnik; Materialwissenschaft; Verstehen; composite solder; intermetallic compound; electronic packaging; solder technology; laser soldering; B; Structural Materials; Metals and Alloys; Chemistry and Materials Science; BB
Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder.- Development of Geopolymer Ceramic Reinforced Solder.- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders.- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process.- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics.- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste.- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi.- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental.- Flux Modification for Wettability and Reliability Improvement in Solder Joints.- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints.- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements.- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth.- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering.- Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations.- Tin Whiskers Growth in Electronic AssembliesWeitere, andere Bücher, die diesem Buch sehr ähnlich sein könnten:
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9783030934408 Recent Progress in Lead-Free Solder Technology Materials Development, Processing and Performances (Salleh, Mohd Arif Anuar Mohd (Herausgeber); Abdul Aziz, Mohd Sharizal (Herausgeber); Jalar, Azman (Herausgeber); Izwan Ramli, Mohd Izrul (Herausgeber))
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