2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Mehr…
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Mehr…
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Mehr…
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2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Mehr…
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ISBN: 9783527326464
hardback, [PU: Wiley-VCH, Weinheim]
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2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Mehr…
2006, ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Mehr…
2006
ISBN: 9783527326464
[ED: Buch], [PU: John Wiley & Sons], Neuware - The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration,… Mehr…
2012, ISBN: 3527326464
Gebundene Ausgabe Elektronik / Halbleiter, Halbleiter, Leitung (physikalisch) / Halbleiter, Materialwissenschaft, Nanotechnologie, Technologie / Nanotechnologie, mit Schutzumschlag 11, [… Mehr…
Bibliographische Daten des bestpassenden Buches
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Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Detailangaben zum Buch - Handbook of Wafer Bonding
EAN (ISBN-13): 9783527326464
ISBN (ISBN-10): 3527326464
Gebundene Ausgabe
Erscheinungsjahr: 2012
Herausgeber: Wiley-VCH
395 Seiten
Gewicht: 0,937 kg
Sprache: Englisch
Buch in der Datenbank seit 2008-09-14T15:42:19+02:00 (Berlin)
Detailseite zuletzt geändert am 2024-01-24T20:43:42+01:00 (Berlin)
ISBN/EAN: 9783527326464
ISBN - alternative Schreibweisen:
3-527-32646-4, 978-3-527-32646-4
Alternative Schreibweisen und verwandte Suchbegriffe:
Autor des Buches: ramm, peter james, peter troy, jia, jian, wiley vch verlag gmbh
Titel des Buches: bon, bonding, bond, handbook
Daten vom Verlag:
Autor/in: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Titel: Handbook of Wafer Bonding
Verlag: Wiley-VCH; Wiley-VCH
396 Seiten
Erscheinungsjahr: 2012-01-11
Gedruckt / Hergestellt in Singapur.
Gewicht: 0,924 kg
Sprache: Englisch
185,00 € (DE)
190,20 € (AT)
Available
170mm x 240mm x 26mm
BB; Hardcover, Softcover / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Chemie; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Weitere, andere Bücher, die diesem Buch sehr ähnlich sein könnten:
Neuestes ähnliches Buch:
9783527644230 Handbook of Wafer Bonding (Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo)
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