ISBN: 9783527644247
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical… Mehr…
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2011, ISBN: 9783527644247
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical… Mehr…
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2011, ISBN: 9783527644247
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2011, ISBN: 9783527644247
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2011, ISBN: 9783527644247
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ISBN: 9783527644247
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical… Mehr…
2011, ISBN: 9783527644247
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical… Mehr…
2011
ISBN: 9783527644247
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical… Mehr…
2011, ISBN: 9783527644247
[ED: 1], 1. Auflage, eBook Download (PDF), eBooks, [PU: Wiley-VCH]
2011, ISBN: 9783527644247
[ED: 1], Auflage, eBook Download (PDF), eBooks, [PU: Wiley-VCH]
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Detailangaben zum Buch - Handbook of Wafer Bonding
EAN (ISBN-13): 9783527644247
ISBN (ISBN-10): 3527644245
Erscheinungsjahr: 2011
Herausgeber: Wiley-VCH
Buch in der Datenbank seit 2009-04-15T15:32:22+02:00 (Berlin)
Detailseite zuletzt geändert am 2020-11-03T17:18:42+01:00 (Berlin)
ISBN/EAN: 9783527644247
ISBN - alternative Schreibweisen:
3-527-64424-5, 978-3-527-64424-7
Alternative Schreibweisen und verwandte Suchbegriffe:
Autor des Buches: peter ramm, jia, james peter
Titel des Buches: bonding, bond
Daten vom Verlag:
Autor/in: Peter Ramm; James Jian-Qiang Lu; Maaike M. V. Taklo
Titel: Handbook of Wafer Bonding
Verlag: Wiley-VCH; Wiley-VCH
396 Seiten
Erscheinungsjahr: 2011-05-18
Sprache: Englisch
165,99 € (DE)
165,99 € (AT)
Available
EA; E107; E-Book; Nonbooks, PBS / Chemie/Sonstiges; Nanowissenschaften; Verstehen; Components & Devices; Electrical & Electronics Engineering; Elektrotechnik u. Elektronik; Halbleiterphysik; Komponenten u. Bauelemente; MEMS; Mikrosystemtechnik; Nanomaterial; Nanomaterialien; Nanomaterials; Nanostrukturiertes Material; Nanotechnologie; Nanotechnology; Physics; Physik; Semiconductor Physics; Wafer; MEMS; Komponenten u. Bauelemente; Nanomaterialien; Halbleiterphysik; Nanotechnologie; BB
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Weitere, andere Bücher, die diesem Buch sehr ähnlich sein könnten:
Neuestes ähnliches Buch:
9783527326464 Handbook of Wafer Bonding (Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo)
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