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Flip chip assembly: Modelling the joints' high-temperature reliability - Amalu Emeka
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Amalu Emeka:
Flip chip assembly: Modelling the joints' high-temperature reliability - Taschenbuch

ISBN: 3659624659

Paperback, [EAN: 9783659624650], LAP Lambert Academic Publishing, LAP Lambert Academic Publishing, Book, [PU: LAP Lambert Academic Publishing], LAP Lambert Academic Publishing, This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature applications. Its focus is to predict the reliability of lead-free solder joints in FC model FC48D6.3C457 which is mounted on a printed circuit board and subjected to Accelerated Temperature Cycles (ATCs) between -38 ºC and 157 ºC and employing IEC standard 60749-25 in parts. It presents the effect of control factors (component standoff height, inter-metallic compound (IMC) thickness, number of thermal cycle and solder volume) on mean-time to failure of the joints. Numerical modelling utilising Finite Element Analysis and employing ANSYS software package and the ANAND's visco-plasticity model, are used to simulate the response of the joints to the ATCs. The responses of other materials in the assembly are simulated using appropriate models. The results demonstrate that the reliability of FC solder joints operating at elevated temperatures is dependent on the control factors. The results also show that incorporating IMC layer in geometric model significantly improves the level of accuracy of fatigue life prediction to ± 22.5%, from ± 25% which is generally accepted., 173515, Engineering, 226498, Aerospace, 13647, Automotive, 226506, Bioengineering, 227539, Chemical, 227541, Civil & Environmental, 227543, Computer Modelling, 8082404011, Construction, 52168011, Design, 227544, Electrical & Electronics, 52215011, Energy Production & Extraction, 227550, Industrial, Manufacturing & Operational Systems, 107157011, Marine Engineering, 226704, Materials & Material Science, 13778, Mechanical, 226719, Military Technology, 13803, Reference, 13809, Telecommunications & Sensors, 173507, Engineering & Transportation, 1000, Subjects, 283155, Books, 21, Reference, 11444, Almanacs & Yearbooks, 11448, Atlases & Maps, 2572, Careers, 11626, Catalogs & Directories, 11472, Consumer Guides, 11475, Dictionaries & Thesauruses, 11713, Encyclopedias & Subject Guides, 11823, English as a Second Language, 11761, Etiquette, 11773, Foreign Language Study & Reference, 11880, Genealogy, 11902, Quotations, 8975382011, Survival & Emergency Preparedness, 5267710011, Test Preparation, 11970, Words, Language & Grammar, 5267707011, Writing, Research & Publishing Guides, 1000, Subjects, 283155, Books, 468212, Engineering, 491336, Aeronautical Engineering, 491338, Chemical Engineering, 491340, Civil Engineering, 491342, Electrical & Electronic Engineering, 684258011, Environmental Engineering, 491346, Industrial Engineering, 491348, Mechanical Engineering, 684259011, Nuclear Engineering, 465600, New, Used & Rental Textbooks, 2349030011, Specialty Boutique, 283155, Books

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Flip Chip Assembly: Modelling the Joints High-Temperature Reliability (Paperback) - Amalu Emeka
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Amalu Emeka:
Flip Chip Assembly: Modelling the Joints High-Temperature Reliability (Paperback) - Taschenbuch

2014, ISBN: 3659624659

ID: 14610958405

[EAN: 9783659624650], Neubuch, [PU: LAP Lambert Academic Publishing, United States], Language: English . Brand New Book ***** Print on Demand *****.This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature applications. Its focus is to predict the reliability of lead-free solder joints in FC model FC48D6.3C457 which is mounted on a printed circuit board and subjected to Accelerated Temperature Cycles (ATCs) between -38 C and 157 C and employing IEC standard 60749-25 in parts. It presents the effect of control factors (component standoff height, inter-metallic compound (IMC) thickness, number of thermal cycle and solder volume) on mean-time to failure of the joints. Numerical modelling utilising Finite Element Analysis and employing ANSYS software package and the ANAND s visco-plasticity model, are used to simulate the response of the joints to the ATCs. The responses of other materials in the assembly are simulated using appropriate models. The results demonstrate that the reliability of FC solder joints operating at elevated temperatures is dependent on the control factors. The results also show that incorporating IMC layer in geometric model significantly improves the level of accuracy of fatigue life prediction to 22.5 , from 25 which is generally accepted.

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Flip chip assembly: Modelling the joints' high-temperature reliability - Emeka Amalu
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Emeka Amalu:
Flip chip assembly: Modelling the joints' high-temperature reliability - Taschenbuch

2014, ISBN: 3659624659

ID: 16085788243

[EAN: 9783659624650], Neubuch, [PU: LAP Lambert Academic Publishing Nov 2014], This item is printed on demand - Print on Demand Neuware - This text intends to give insight into assembly of flip chip (FC) package and its reliability at high-temperature applications. Its focus is to predict the reliability of lead-free solder joints in FC model FC48D6.3C457 which is mounted on a printed circuit board and subjected to Accelerated Temperature Cycles (ATCs) between -38 ºC and 157 ºC and employing IEC standard 60749-25 in parts. It presents the effect of control factors (component standoff height, inter-metallic compound (IMC) thickness, number of thermal cycle and solder volume) on mean-time to failure of the joints. Numerical modelling utilising Finite Element Analysis and employing ANSYS software package and the ANAND s visco-plasticity model, are used to simulate the response of the joints to the ATCs. The responses of other materials in the assembly are simulated using appropriate models. The results demonstrate that the reliability of FC solder joints operating at elevated temperatures is dependent on the control factors. The results also show that incorporating IMC layer in geometric model significantly improves the level of accuracy of fatigue life prediction to ± 22.5%, from ± 25% which is generally accepted. 228 pp. Englisch

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Flip chip assembly: Modelling the joints' high-temperature reliability - Amalu Emeka
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Amalu Emeka:
Flip chip assembly: Modelling the joints' high-temperature reliability - Taschenbuch

2014, ISBN: 3659624659

Paperback, [EAN: 9783659624650], LAP Lambert Academic Publishing, LAP Lambert Academic Publishing, Book, [PU: LAP Lambert Academic Publishing], 2014-11-05, LAP Lambert Academic Publishing, This text intends to give insight into assembly of flip chip (FC) package and its reliability at hig...., 922260, Reference, 278115, Engineering & Technology, 57, Science & Nature, 1025612, Subjects, 266239, Books, 564346, Engineering, 571042, Chemical & Biochemical Engineering, 571044, Civil Engineering, 571500, Electrical Engineering, 571046, Electronics & Telecommunications Engineering, 571052, Energy Engineering, 571056, Engineering Skills & Design, 571048, Environmental Engineering, 573598, Industrial Chemistry & Manufacturing Technologies, 571050, Mechanical & Material Engineering, 564334, Scientific, Technical & Medical, 1025612, Subjects, 266239, Books

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Flip chip assembly: Modelling the joints' high-temperature reliability - Amalu Emeka
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Flip chip assembly: Modelling the joints' high-temperature reliability - Taschenbuch

2014, ISBN: 3659624659

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[EAN: 9783659624650], Neubuch, [PU: LAP Lambert Academic Publishing], This item is printed on demand for shipment within 3 working days.

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