>100: Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor p… Mehr…
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. TECHNOLOGY & ENGINEERING,Materials Science,General, eBooks.com<
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M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor … Mehr…
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. Books > Materials Science eBook, Springer Shop<
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M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor p… Mehr…
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. Books > Materials Science eBook, Springer Shop<
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Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical-Mechanical Planarization of Semiconductor Materials ab 181.99 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher, Chemical-Mechanical Pla… Mehr…
Chemical-Mechanical Planarization of Semiconductor Materials ab 181.99 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher, Chemical-Mechanical Planarization of Semiconductor Materials - eBook als pdf von - Springer Berlin Heidelberg - 9783662062340<
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Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor p… Mehr…
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. TECHNOLOGY & ENGINEERING,Materials Science,General, eBooks.com<
new in stock. Versandkosten:más costos de envío., zzgl. Versandkosten
Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor … Mehr…
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. Books > Materials Science eBook, Springer Shop<
new in stock. Versandkosten:zzgl. Versandkosten. (EUR 0.00)
M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor p… Mehr…
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however. Books > Materials Science eBook, Springer Shop<
Chemical-Mechanical Planarization of Semiconductor Materials - neues Buch
ISBN: 9783662062340
Chemical-Mechanical Planarization of Semiconductor Materials ab 181.99 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher, Chemical-Mechanical Pla… Mehr…
Chemical-Mechanical Planarization of Semiconductor Materials ab 181.99 € als pdf eBook: . Aus dem Bereich: eBooks, Sachthemen & Ratgeber, Technik, Medien > Bücher, Chemical-Mechanical Planarization of Semiconductor Materials - eBook als pdf von - Springer Berlin Heidelberg - 9783662062340<
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Detailangaben zum Buch - Chemical-Mechanical Planarization of Semiconductor Materials
EAN (ISBN-13): 9783662062340 Erscheinungsjahr: 2013 Herausgeber: Springer Berlin Heidelberg
Buch in der Datenbank seit 2017-05-09T03:41:21+02:00 (Berlin) Detailseite zuletzt geändert am 2022-04-07T05:04:48+02:00 (Berlin) ISBN/EAN: 9783662062340
ISBN - alternative Schreibweisen: 978-3-662-06234-0
Daten vom Verlag:
Autor/in: M.R. Oliver Titel: Springer Series in Materials Science; Chemical-Mechanical Planarization of Semiconductor Materials Verlag: Springer; Springer Berlin 428 Seiten Erscheinungsjahr: 2013-03-14 Berlin; Heidelberg; DE Sprache: Englisch 213,99 € (DE) 220,00 € (AT) 236,00 CHF (CH) Available XI, 428 p.
EA; E107; eBook; Nonbooks, PBS / Technik/Maschinenbau, Fertigungstechnik; Werkstoffprüfung; Verstehen; dielectrics; material; metals; reactions; semiconductor; semiconductor technology; C; Characterization and Analytical Technique; Electronics and Microelectronics, Instrumentation; Machines, Tools, Processes; Physical Chemistry; Surfaces, Interfaces and Thin Film; Optical Materials; Chemistry and Materials Science; Elektronik; Fertigungstechnik und Ingenieurwesen; Physikalische Chemie; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; BC
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanisms Includes supplementary material: sn.pub/extras;
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